Table of contents:
- Picture gallery
- Leap into the digital age
- Motek 2016
- Bondexpo competence expanded through the Bondexpo congress
Video: Production And Assembly Automation Is Going Digital
After four days at the fair, this year's Motek - International Trade Fair for Production and Assembly Automation and the Bondexpo - International Trade Fair for Adhesive Technology, held in parallel, came to an end. 1,049 exhibitors from 29 nations presented themselves on around 68,000 m² gross exhibition area and attracted 35,434 trade visitors with their specific product and service portfolio. These came from 90 different countries, which, according to the exhibition company PE Schall GmbH & Co. KG, allows conclusions to be drawn about the high status of Motek and Bondexpo as a globally recognized business platform. "Motek is rightly considered the automation highlight in southern Germany," confirmed Hubert Wicker, Ministerial Director at the Ministry of Economy, Labor and Housing in Baden-Württemberg.
Picture gallery
According to statements by numerous well-known and loyal and first-time exhibitors at Motek, the level of trade visitors was at a very high level in terms of decision-making authority and above all willingness to invest. The late fair maker Paul E. Schall's credo was thus repeated: "We make trade fairs for markets and quality is more important than quantity".
Leap into the digital age
As you would expect, the trend topics of Industry 4.0 and Big Data and the associated digitalization of the industrial world ran like a red thread through the product and service offers of Motek and Bondexpo. There was hardly a component, an assembly, a partial or even a complete solution that was not provided with the appropriate hardware and software interfaces for higher-level control and communication. Wicker: “Increasing digitalization is fundamentally changing the way we produce and work. With Industry 4.0 and the advent of the Internet of Things in factories, new impulses for smart value chains and new business models are emerging. Motek and Bondexpo have the right focus here.”
Motek 2016
Image gallery with 35 images
Bondexpo competence expanded through the Bondexpo congress
Bondexpo celebrated its 10th anniversary this year. According to the organizer, the fair was able to convince with its product, know-how and competence presentation. In addition, there was an accompanying program for the first time this year. The 1st Bondexpo Congress was held together with the cooperation partners Isgatec GmbH, Otti and Leichtbau Cluster / Hochschule Landshut. This dealt with all aspects of adhesive, sealing, joining and joining technology, with special attention being paid to the manufacturing and assembly challenges in lightweight construction.
The Motek - International Trade Fair for Production and Assembly Automation and the Bondexpo - International Trade Fair for Adhesive Technology will take place in the Landesmesse Stuttgart from October 9th to 12th. (sh)