Electronics Cooling And Heat Management - Simulation Vs. Try

2023 Author: Hannah Pearcy | [email protected]. Last modified: 2023-08-25 03:36

The cooling of electronic components, assemblies and systems up to entire systems has always been part of the tools of hardware developers and system designers. However, due to the unstoppable increase in packing density and the steadily increasing throughput, this classic engineering task becomes a constant challenge.

ELEKTRONIKPRAXIS has launched the Cooling Days to ensure that electronics developers and device manufacturers can meet these challenges in the best possible way. Numerous aspects of electronic cooling will be analyzed over three days. Experts from industry and research explain the most important basics of heat management and present new processes and products for electronic cooling.

Electronics Cooling & Heat Management Congress October 23-25, 2018 in Würzburg >> Prices and registration

The focus of the Cooling Days this year is on basics and simulation on October 23, technology trends and best practice on October 24, and control cabinet cooling and power electronics on October 25: www.cooling-days.de.

Electronics cooling: basics and thermal simulation

On Tuesday, October 23rd there will be an expert seminar with four speakers on the basics of electronics cooling, principles of heat management and thermal simulation for electronics. The following topics are presented and analyzed:

9:00 a.m.: The physical basics: heat transport through conduction, flow and radiation, including basic equations for rollover calculations, Prof. Dr. Andreas Griesinger, Baden-Wuerttemberg Cooperative State University.

11:10 a.m.: Surfaces, boundary layers and thermal interface materials: Practical tips for the use of thermal interface materials, gap fillers and phase change materials, Robert Liebchen, ZFW Stuttgart.

1:40 pm: Methods for the characterization of heat paths in electronics: Comparison of different measurement and analysis methods for the detailed determination of thermal conductivity properties, Prof. Dr. Andreas Griesinger, Baden-Wuerttemberg Cooperative State University.

3:50 p.m.: Thermal simulation for electronic cooling: Optimizing the thermal management of assemblies, devices and systems using simulation - approach, possibilities, limits and examples, Tobias Best, Alpha Numerics.

7:30 p.m.: An evening with cool beer in the brewery at Würzburg harmoniously rounds off this grand location day.

Electronics cooling: problems, trends and best practice

On Wednesday, October 24, numerous speakers will speak with current problems and new approaches:

9:00 am: Principles and possibilities of thermal simulation using the example of batteries and accumulators, Prof. Dr. Andreas Griesinger, Baden-Wuerttemberg Cooperative State University.

9:45 am: Thermal simulation of fully detailed boards in their installation situation, Tobias Best, Alpha Numerics.

11:10 am: Strategies for electronics cooling - The strategic selection of technologies for electronics cooling, Dr. Christoph Lehnberger, ANDUS ELECTRONIC.

11:40 a.m. What can metal-based PCB laminates do? And which new technologies allow higher and improved cycle stability and service life? Michael Stoll, The Bergquist Company:

12:10 p.m.: The F-Gas Regulation EU 517/2014 and its effects on the use of refrigerants in cooling systems - problems in the search for sensible alternatives, Ralf Schneider, Rittal.

1:40 p.m.: Preventive fire protection in electrical devices, Rajko Eichhorn, Job.

2:10 p.m.: Use of Peltier elements for cooling electronic components and systems, Ina Sengebusch, EURECA Messtechnik.

2:40 p.m.: Heat sink from the 3D printer to cool down a converter with extremely high power density, Dominik Hilper, FH Kiel.

3:50 pm: New developments in casting resins: polyurethane and epoxy systems with high temperatures and high thermal conductivity, Jens Bürger, ELANTAS.

4:20 p.m.: Use of electrically insulating injection molding materials for heat dissipation via housing elements - advantages, possibilities and limits, Helmut Aicher, PlastFormance.

4:50 p.m.: Silicone-containing vs silicone-free heat-conducting materials: operating conditions, restrictions, outgassing, bleeding, contamination - what is behind it? Holger Schuh, THE BERGQUIST COMPANY.

Control cabinet cooling and power electronics

The following lectures from the area of control cabinets and power electronics are planned for Thursday, October 25:

9:00 a.m.: Simulate and optimize airflow in rack sub-assemblies, Tobias Best, Alpha Numerics.

9:45 a.m.: Challenges in cooling power electronics.

11:00 a.m.: Process for effective heat management for power electronics, Ralf Schneider, Rittal.

11:45 a.m.: Methods for control cabinet configuration and functional software solutions.

1:30 p.m.: Methods of control cabinet cooling and practical examples: passive cooling, fans, cooling devices, air / water heat exchangers.

2:15 p.m.: Cold water supply in practice: piping concepts and chillers, Ralf Schneider, Rittal.

3:30 p.m.: Smart switchgear air conditioning through wireless temperature monitoring, Dr. Andreas Weder, Fraunhofer Institute for Photonic Microsystems (IPMS).

4:15 p.m.: Remote Condition Monitoring and Predictive Maintenance: Cloud monitoring, energy management and function monitoring of control cabinet cooling units and chillers with the help of software-based analysis tools.

Parallel to the Cooling Days 2018 (www.cooling-days.de) there are further specialist conferences: the Power Congress (www.power-kongress.de), the new DC / DC converter day (www.dc-dc- wandler-tag.de) and the Datacenter Day (www.dc-day.de).

The participants of all conferences meet on October 23 and 24 in a joint exhibition that offers many interesting starting points: an ideal opportunity for networking among the participants and with experts from research and industry.

This article first appeared on our partner portal Elektronikpraxis.de.